Apparatus for making vehicle panel assembly

ABSTRACT

A mold assembly for forming a panel assembly having a gasket on one surface for use as a flush-mounted panel or window in vehicles, buildings, or other structures includes a mold cavity defined in a facing surface of one mold section and a pressure pad on the second mold section, the pressure pad being urged against the surface of a sheet-like panel at a position opposite the mold cavity with the panel being held against a support surface adjacent the mold cavity when the mold sections are closed. Preferably, the pressure pad is a heat insulative pad which is urged against the panel surface by a resilient member preferably formed from urethane. The support surface and mold cavity are preferably raised above and offset from adjacent portions of the first mold section, and the size of the raised area of the support surface and mold cavity preferably corresponds in size to the area of the pressure pad.

CROSS REFERENCE TO RELATED APPLICATION

This is a division of application Ser. No. 08/027,078, filed Mar. 5,1993 now U.S. Pat. No. 5,544,458.

BACKGROUND OF THE INVENTION

This invention relates to panel assemblies, and particularly toflush-mounted panel assemblies having a gasket mounted on a single sideand used as panels or windows in vehicles, buildings or otherstructures, as well as a method and apparatus for making such panelassemblies.

Relatively recent in the history of vehicle window panel assemblies,gaskets have been molded or extruded directly on to the window panel. Inmolded window panels, a sheet of glass is closed within a molding tool,and a polymeric material is then injected around the peripheral edge onthe opposing surfaces, thereby capturing the peripheral edge of theglass panel within the injected polymeric material. After the materialhas cured, the mold is opened and the panel assembly is removed. Toretain the modular panel assembly within the vehicle, studs or clips maybe molded within or attached to the gasket and panel and used to engagethe pinch flange forming the vehicle opening. Alternatively, or inaddition thereto, a bead of adhesive can be applied to bond the panelassembly directly to the pinch flange.

New styling requirements are calling for flush-mounted glass panelshaving an exposed peripheral edge on the glass panel. One flush-mountedvehicle panel assembly on the market includes an extruded gasket of athermosetting material deposited directly on one surface of a glasssheet. Often the extrusion includes two adhesive beads of polyurethanecompounds, one deposited by the panel assembly manufacturer and theother applied by the vehicle assembler. Disadvantages associated withthe extruded gaskets include long cure time for the first bead, addingcycle time to manufacturing. In addition, the gasket material used informing the extruded gasket is typically not UV stable by itself and candegrade over time. Moreover, the extrusion does not easily adapt itselfto receive mounting studs or clips. In addition, gaskets having avariable cross section cannot easily be formed using the extrusionmethod. Moreover, the extrusion compound is expensive and requiresspecial storage and handling once formed.

Another window assembly intended for use in flush-mounted applicationsis a gasket of a thermosetting material molded directly to a singlesurface of a panel in a molding machine using reaction injection molded(RIM) urethane. Although this technique offers some variable crosssections, disadvantages include instability when subjected to prolongedexposures of UV light, a long cycle time in forming, and increasedmaterial costs compared with other materials such as thermoplasticelastomers, and in particular, thermoplastic vinyls including PVC. Inaddition, tensional or shear force applied between the glass and thegasket results in failure of the adhesive seal of the gasket with thepanel as opposed to the desired loss of cohesion in the gasket itself.

None of the prior panel assemblies or methods provide flush-mountedgaskets having adhesion and bonding characteristics where thecohesiveness of the gasket fails under shear and peel tests afterprolonged soaking in water. In particular, the prior methods or panelassemblies fail to provide a flush-mounted gasket having adhesion andbonding characteristics between gasket and panel surface which withstanda shear force in excess of 300 pounds per square inch or a 180 degreepeel test greater than 30 pounds per linear inch after being soaked in80° C. water for 250 hours or more. Any resulting failure occurs in theadhesion of the gasket to the panel surface.

Thus, a need has existed in the industry for an excellent, reliable,high strength bond formed between the panel surface and the gasket of aflush mounted panel assembly having a single-sided gasket wherein thebond is capable of withstanding prolonged exposure to water. Such bondshould not degrade or erode because of water wicking between the panelsurface and the gasket, which in prior assemblies results in the failureof the gasket to panel bond in tests.

SUMMARY OF THE INVENTION

Accordingly, the present invention includes a unique panel assembly,especially for vehicles, having a gasket bonded to a single surface of apanel, and adapted to use in flush mounted applications wherein adhesionof the gasket to the panel, the water resilience of the adhesive jointthereto, is unsurpassed by prior known assemblies. The invention alsoincludes a new mold assembly for forming the gasket on the panel. Thenew mold assembly uses lower clamping and injection pressures to producethe panel assembly in less time and with less product breakage orrejection than produced by conventional PVC injection molding systems.The invention further includes a method for manufacturing the panelassembly which results in the improved adhesion of the gasket to thepanel unobtainable using prior known methods.

In one form, the panel assembly of this invention includes a sheet-likepanel having a pair of surfaces terminating in a peripheral edge. Aprimer overlies a predetermined area of the panel surface, the primerhaving a predetermined transition temperature. Molded to the panel on atleast a portion of the panel surface having the primer is a polymericgasket, the gasket being molded on the primer at a temperature greaterthan or equal to the primer transition temperature. For one preferredprimer, the transition temperature is about 250° F.

In another form, the panel assembly of this invention includes a panelof predetermined geometry having opposing surfaces which terminate in aperipheral edge. Deposited on a portion of at least one surface of thepanel is a bonding material. The bond material receives a gasket formedthereon and bonds the gasket to the one surface of the panel such thatthe bond withstands a shear force greater than 300 pounds per squareinch and a 180 degree peel force greater than 30 pounds per linear inchafter soaking for at least 250 hours in water having a temperaturegreater than 175° F. (80° C.). If failure occurs, it is desirable thatthe failure occur in the cohesiveness of the gasket, and not at theadhesive bond between the gasket and the panel.

In yet another form of the panel assembly, the gasket may be molded soas to have a variable cross section around the same panel. Furthermore,the gasket may be molded about and partially encapsulate guiding ormounting hardware used to locate and fix the panel assembly in thewindow opening. Alternatively, such hardware may be located inboard,outboard or on the gasket. An adhesive such as a bead of urethane orstrip of butyl tape may also be used to retain and/or seal the panelassembly in the window opening. Preferably, the gasket is molded from athermoplastic polymeric material such as polyvinyl chloride.

According to another aspect of the invention, the panel assemblydescribed above is manufactured in a mold assembly including at least apair of cooperating mold sections movable between open and closedpositions. A mold cavity is defined in a facing surface of one moldsurface and adapted to support and seal against one surface of thesheet-like panel. A heat insulative pad is retained in a facing surfaceof the opposite mold section to be urged against a surface of thesheet-like panel directly opposite the mold cavity when the pair of moldsections are closed.

According to yet another form of the inventive mold assembly, a pressurepad is retained in a facing surface of one mold section and is urgedagainst the panel directly opposite the mold cavity to force the panelagainst and seal with the facing surface of the second mold sectionwhich contains the mold cavity when the mold sections are closed.

The panel assembly and mold assembly are used in association with amethod to produce the improved bond of the gasket to one surface of thepanel. According to one form, the method includes providing a sheet-likepanel having a primer coating having a predetermined transitiontemperature applied to a portion of the surface of the panel. The paneland primer are subsequently heated to a temperature at least equal tothe transition temperature of the primer. With the primer at thetransition temperature or higher, a polymeric gasket is molded onto aportion of the panel covered by the primer. The polymeric gasket ismolded at a temperature at least equal to the transition temperature ofthe primer. According to a narrower aspect of the method, the panelassembly is post heated from a side opposite that containing the gasket.Heat is applied for up to 30 minutes to again raise the temperature ofthe primer up to or above the primer transition temperature.

According to yet another aspect, the invention includes a panel assemblymade according to the method, including providing a panel having aprimer coating have a known primer transition temperature is applied toat least a portion of a panel surface. Subsequently, the panel andprimer coating are heated to raise the temperature of the primer to atleast the transition temperature of the primer. While maintaining thetemperature of the panel and primer greater than the primer transitiontemperature, a polymeric gasket is molded onto the primer coating. Themelt temperature of the polymeric material is preferably at atemperature at least equal to the transition temperature of the primer.

The advantages provided by the various aspects of the invention arenumerous. These include a superior, and heretofore unobtainable,adherence of a molded gasket to a single surface of a panel for use inflush-mounted panel applications. In addition to the superior bond,other advantages include as much as a two-thirds weight reduction in thefinished gasket over prior panel assemblies having three-sided PVCencapsulating. The substantial reduction in weight is achieved by usingless material per linear inch to form the gasket than in priorassemblies which, in turn, produces less encroachment in from the panelperipheral edge. Since less material is used, this savings is translatedinto lower costs than for prior three-sided PVC encapsulated panelassemblies. The molding of the gasket to a single surface of the panelpermits gaskets of variable cross section about the entire panel,unobtainable using an extrusion technique. Moreover, the gaskets of thepresent invention provide a substantially impenetrable barrier to waterwicking between the panel and the gasket. The resistance to waterpenetration and degradation also makes this structure and methodapplicable to many other uses in addition to flush mounted modularvehicle window assemblies. Advantages provided by the manufacturingprocess include less clamping tonnage and injection pressures thanconventional PVC injection molding techniques which results in lessflash, and waste due to breakage, improved cycle times for eachassembly, and increased productivity. Also, the single sided gaskets canbe made less wide, and hence less obtrusive, using the concept of thisinvention while still retaining the advantages listed above.

BRIEF DESCRIPTION OF THE DRAWING FIGURES

A better understanding of the invention and advantages provided therebymay be obtained by reference to the specification and the attacheddrawing figures, wherein:

FIG. 1 is a fragmentary, perspective view of a vehicle containing oneembodiment of the panel assembly of the invention;

FIG. 2 is a view of the interior side of the panel assembly shown inFIG. 1 and removed from the vehicle opening;

FIGS. 3, 4 and 5 are fragmentary section views of several embodiments ofthe panel assembly taken along line III--III shown in FIG. 1;

FIGS. 6, 7, 8, 9, 10, 11 and 12 are fragmentary sectional views ofalternate embodiments of the panel assembly taken along lines VI--VI andVII--VII shown in FIG. 1;

FIG. 13 is a plan view of one half of a mold assembly of the presentinvention;

FIG. 14 is a plan view of an opposite half of the mold assembly of thepresent invention;

FIG. 15 is a section view through the mated mold halves taken along lineXV--XV shown in FIGS. 13 and 14;

FIG. 16 is a fragmentary section view of the mated mold halves takenalong line XVI--XVI shown in FIGS. 13 and 14;

FIG. 17 is a fragmentary section view of the mated mold assembly takenalong lines XVII--XVII shown in FIG. 14;

FIG. 18 is a fragmentary section view of the mated mold assembly takenalong line XVIII--XVIII shown in FIG. 14;

FIGS. 19 and 20 illustrate two examples of energy sources used forheating in association with the method of the invention;

FIG. 21 is a flow diagram illustrating one embodiment of the method ofthis invention; and

FIG. 22 graphically illustrates the adhesion characteristics of severaladhesive primers used in the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

For the purposes of the following description, the terms "upper,""lower," "right," "left," "front," "rear," "vertical," "horizontal," andderivatives or equivalents thereof shall relate to the invention asoriented in FIGS. 2, and 13-15. It is understood that the invention mayassume various alternative orientations, except where expresslyspecified to the contrary. It is also understood that the specificdevices and processes illustrated in the attached drawings, anddescribed in the following specification, are simply exemplaryembodiments of the inventive concepts defined in the appended claims.Hence, specific dimensions and other physical characteristics relatingto the embodiments disclosed herein are not to be considered limitingunless the claims expressly state otherwise.

PANEL ASSEMBLIES

Referring now to FIGS. 1-12, different embodiments of the inventivepanel assembly are shown. FIGS. 1-3 illustrate one embodiment of asingle-sided gasketed panel assembly 20 of the present inventionspecifically adapted for closing a window in a vehicle opening 21,although it is contemplated that the same structure and method may beused for panel assemblies in buildings, ships and the like. Panelassembly 20 includes a panel or sheet 22; preferably of transparentglass which may be tempered, laminated, or otherwise strengthened usingconventional techniques and principles. Sheet 22 has two substantiallyparallel sides, surfaces, or faces 24, 26 which terminate at aperipheral edge 28 of predetermined geometric shape. Althoughtransparent glass is preferred, other sheet-like panel materials may beused such as opaque or coated glass, transparent coated or opaqueplastic materials, or multi-composite laminates, such as transparentglass and plastic.

Optionally, and preferably, deposited on and bonded to surface 26 ofpanel 22 is an opaque, and preferably black frit layer, and mostpreferably a ceramic frit layer or coating 30 covering and concealing aregion from peripheral edge 28 inward. Alternately, frit layer 30 maycover all or substantially all of surface 26. Usually, however, fritlayer 30 conceals a peripheral area of surface 26 near edge 28, such astwo or so inches in from edge 28. Glass panel 22, which is initially inan untempered condition after cutting and sizing to its desired shape,is painted by screen coating or other techniques, with a coating of darkceramic paint on its rear surface 26. Thereafter, glass panel 22 issuitably heated and bent to the desired contour with a bending furnaceor other bending apparatus, followed by tempering to strengthen theglass. Such heating, bending, and tempering operations cause the ceramicpaint on surface 26 of the glass to become fused to the surface 26.Thus, although starting as a layer of paint containing ceramic particlesand pigment, coating 30 ends up, after bending and tempering, as a thinfrit layer of ceramic material which, in actuality, is fused to surface26 of glass panel 22. Since ceramic frit coating 30 includes pigment ofa desired color, preferably a dark color such as black, dark blue, orthe like, the layer results in a permanent, second surface coloration ofthe glass panel. When viewed from the front side, the transparentthickness of panel 22, backed up by the colored ceramic frit layer 30,provides an appearance of depth and richness which blends well with thesurrounding painted or glass areas on a vehicle.

One ceramic paint used to form the opaque black ceramic frit coating 30,described above, is manufactured by Drakenfeld Pigments Division ofCiba-Geigy Corporation of Washington, Pa. Such paint includes smallceramic particles and a suitable metal oxide pigment suspended in oil ofa type conventionally known in the art. The resulting frit layer isopaque and normally black in color. This ceramic paint is preferablyscreen-coated on a predetermined portion of rear surface 26 of panel 22using a 200 mesh screen. The resulting frit layer 30 has the ceramicparticles melted and fused to one another, is permanently bonded andfused to the rear glass surface 26, and is the equivalent of the glassitself in terms of strength and adherence.

Fixed to ceramic frit layer 30, and extending along and around at leasta portion of sheet 22 and spaced in from peripheral edge 28, is aflexible, resilient polymeric form or bead which defines a staticspacer, gasket, or grommet 32 (hereinafter "gasket") intended to engagepinch flange 31 of the window opening when installed. It is preferredthat polymeric gasket 32 be formed from a thermoplastic material such asa thermoplastic elastomer selected from the group of thermoplasticrubbers (TPR), thermoplastic urethanes (TPU), thermoplastic olefins(TPO), and thermoplastic vinyls (TPV). It is most preferred to formgasket 32 from a thermoplastic vinyl such as polyvinyl chloride (PVC).

In one embodiment (FIG. 3), gasket 32 includes a body 34 of generallytrapezoidal cross section having a first surface 36 in intimate contactwith, and bonded to, ceramic frit layer 30. An opposite surface 38includes a generally rectangular channel 40 which may extend along theentire length of spacer or gasket 32. Channel 40, in turn, defines firstand second flanges 42, 44, respectively, which run adjacent channel 40.Although it is preferred that gasket 32 have a width less than or equalto 0.75 inch and a thickness less than or equal to 1.0 inch, thethickness and width of gasket body 34 and flanges 42, 44 may varydepending upon the application of window panel assembly 20. One portionof gasket 32 may have a profile upwards of 1.0 inch thick, while anotherportion may have a thinner, low profile at another location on panel 22.The width dimension may also vary as shown in FIG. 2 such as the widerareas where guides/fasteners 84 are located. As will become moreapparent, panel 22 may also have a spacer or gasket with more than onecross-sectional profile, or might have separate portions of the same ordiffering size, thickness, width and/or profile.

Although gasket 32 may be made using a variety of techniques, includingliquid, slurry and compression molding, the preferred technique isinjection molding using the preferred PVC material. An example of apreferred PVC is Vista brand 462-34B flexible PVC compound having aShore harness of approximately 85 "A" durometer and a specific gravityof approximately 1.35 grams per cubic centimeter. The Vista brand462-34B PVC compound is available from Vista Chemical Company located inAberdeen, Miss. It is contemplated that other molding materials may alsobe used including thermoplastic elastomers such as KRAYTON™thermoplastic rubber (TPR), thermoplastic urethane (TPU) andthermoplastic olefin (TPO).

Bonding gasket 32 to ceramic frit layer 30 is an adhesive primer layer46. Adhesive 46 preferably has an acrylic base included with across-linking component. Most preferably, adhesive primer 46 has anacrylic base, and a cross-linker including an epoxy component and asilane coupling agent. The silane coupling agent may be mixed with theprimer components or applied separately. In the adhesive primers foundto provide the best adhesion, the ratio of the epoxy compound and thesilane coupling agent, by equivalent weight, is greater than one. TableI provides a listing of the adhesive primers found to produce thedesired adhesive properties.

                  TABLE I                                                         ______________________________________                                        Manufacturer                                                                            City, State                                                                              Designation                                              ______________________________________                                        B. F. Goodrich                                                                          Akron, OH  A-1100B plus A-1167B at 20:1 ratio                       Donnelly Corp.                                                                          Holland, MI                                                                              A-57 (includes silane coupling                                                agent)                                                   B. F. Goodrich                                                                          Akron, OH  EXP541 plus EXP535 at 20:1 ratio                         Donnelly Corp.                                                                          Holland, MI                                                                              A-47 (includes silane coupling                                                agent)                                                   ______________________________________                                    

The preferred adhesive primer used in the panel assembly, and methoddescribed below, is Donnelly Corporation's A-57. The A-57 primeradhesive includes 27.7 weight percent of a Polymethylmethacrylate (PMMA)acrylic solution component designated Acryloid™ A-105 produced by Rohmand Haas of Bristol, Pa., 1.9 weight percent of an epoxy resin componentdesignated D.E.R. 331 available from Dow Chemical located in Midland,Mich., and a 1.1 weight percent of a aminoalkyl functional silanecomponent designated Z-6020 available from Dow Corning, also located inMidland, Mich. The respective ratios of each of the components are mixedwith 48 weight percent toluene solvent and 21.3 weight percent methylalcohol to achieve the preferred consistency. The Donnelly A-47 primeradhesive includes 2.0 parts of B.F. Goodrich A-1100 B acrylic base mixedwith 1 part BETASEAL brand 43547 silane component available from EssexChemical Corp. of Sayerville, N.J.

All of the adhesive primers 46, identified above in Table I, exhibit asignificant improvement in its adhesion after being heated to atemperature greater than its transition temperature, which is usually atleast 200° F. and receiving the molded gasket 32 while at or above thattemperature. The temperature at which this marked improvement in bondingoccurs is defined as the "primer transition temperature". For theprimers identified above, the primer transition temperature is above200° F. This characteristic and the method for determining the primertransition temperature will be described in greater detail below.

In a preferred embodiment a butyl seal 48 is located on gasket 32 aftermolding so as to form a seal between gasket 32 and pinch flange 31. Itis preferred to locate seal 48 along surface 38 and most preferably inchannel 40 such as shown in FIG. 9. Alternatively, butyl tape 59 may bedeposited in channel 40' to form a water resistant seal with pinchflange 31 (FIG. 5). When used in combination with fasteners 84, gasket32 compresses seal 48 against pinch flange 31 to form a substantiallyweather tight seal. One example of a suitable butyl tape or seal isavailable from Preform Sealant Inc. of Warrenville, Ohio and isdesignated 5.5 mm air core. In the alternative, and preferably whenpanel assembly 20 is not mechanically assisted to remain in the vehicleopening, a urethane adhesive 58, 58' is used. See FIGS. 3-4 and 6-8. Oneexample of a suitable urethane adhesive is BETASEAL brand adhesiveavailable from Essex Chemical Corp. of Sayerville, N.J. which is aurethane material. Adhesive 58 is selected for its ability to bond glassor ceramic to metal and retain panel assembly 20 within the vehicleopening. In one embodiment shown in FIG. 4, an adhesive bead 58' isdeposited along surface 38 in channel 40 to bond panel assembly 20 topinch flange 31. In this embodiment, the spacing of gasket 32' inwardlyfrom edge 28, i.e., the encroachment of gasket 32' and frit layer 30inwardly from peripheral edge 28, is minimized.

In another embodiment, shown in FIG. 6, in addition to gasket 32described above, panel assembly 20 may include a second gasket 60adapted to engage the panel opening or exterior of the vehicle. Gasket60 is preferably molded onto and bonded to panel 22 about at least aportion of peripheral edge 28 and in some cases to a portion of fritlayer 30. In those applications where it is desirable to close the gasbetween panel peripheral edge 28 and the panel opening, gasket 60 isformed so that it substantially encloses or encapsulates peripheral edge28. Typically, gasket 60 is also applied over the same adhesionpromoting primer coating as applied to the areas of panel 22 over whichthe single-sided gasket is molded.

Gasket 60 includes a body portion 62 from which a pair of securingflanges 64, 66 extend inwardly a predetermined distance over opposingpanel surfaces 24, 26, respectively. A lip portion 68 extends from body62 in a direction generally opposite to securing flanges 64, 66 toengage the vehicle panel opening or body. A bead of BETASEAL or otheradhesive may be deposited on frit layer 30 between spacer 32 and seal 60or in channel 40, as described above. When mechanical fasteners areused, it is preferred to use the butyl seal 48 as described above.Together with any locating or mounting hardware, described below, seal48 seals panel assembly 20 in the panel opening.

Another form of the inventive panel assembly 20, shown in FIG. 7,provides an exterior gasket or lip seal 70 for use on automotive windowsurfaces which are exposed to the exterior and in view, known as "ClassA" surfaces. Panel 22 includes a ceramic frit layer 30 deposed onsurface 26 proximate peripheral edge 28. A bead of urethane adhesivesuch as 58, described above, bonds panel 22 to pinch flange 31 formingopening 21. A portion of panel surface 24 proximate peripheral edge 28receives part of surface 72 of molded lip seal 70 which is bondedthereto by adhesive primer 46 using the method of the present invention.The remaining portion of lip seal 70 extending and cantilevered frompanel 22 is designed to bridge and close a gap between peripheral edge28 and the vehicles body to seal out water, dust, and othercontaminants.

Yet another form of the inventive panel assembly 20 uses mechanicallocators or mounting hardware to position, guide, and fix panel assembly20 within window opening 21. One embodiment, shown in FIG. 8, includes alocating and mounting stud 82 having a shaft portion 84 terminating atone end in a head portion 92. Head portion 92 and a portion of shaft 84are encapsulated within gasket 32 such that the remaining portion ofshaft 84 extends out from gasket 32 and in a direction away from panel22. It is preferred that shaft 84 extend from surface 38 in a directionsubstantially perpendicular to panel 22. Channel 40, in a preferredembodiment, becomes substantially narrowed and located to the outboardside of gasket 32 as it extends around the location of stud 82. Ifdesired, a fastener may be attached to stud 82 on the opposite side ofpinch flange 31, to pull gasket 32 tightly against pinch flange 31 andretain panel assembly 20 in place. As in the previous embodiments, abead of adhesive 58 may be located either outboard or on gasket 32 tohelp retain and seal the panel assembly within window opening 31.

FIGS. 10-12 illustrate alternative types and locations of mountinghardware which may be used in association with the inventive panelassembly 20. FIG. 10 illustrates a stud or locating pin 82 positionedwith head 92 seated in gasket channel 40 and retained by a thin bead ofadhesive 58. The shaft 84 extends from channel 40 away from panel 22 andis received in a hole 74 in pinch flange 31. A speed nut or otherfastener (not shown) may be received along shaft 84 to pull gasket 32against flange 31.

Advantages offered by the location of the locating or mounting hardware,such as shown in FIGS. 8-10, is the ability to securely fasten panel 22within opening 21 without encroaching into the viewing area orincreasing the panel size. In those situations where these factors arenot as critical, the locating and mounting hardware (FIG. 11) may belocated either inboard or outboard of gasket 32. As shown in FIG. 11,stud 82 is bonded directly to frit layer 30 inboard of gasket 32 using asuitable adhesive such as 58. In the alternative, stud 82 may be bondedas described in U.S. Pat. No. 5,675,956, which is incorporated herein byreference.

As an alternative to studs 82, clips 76 may be used as shown in FIG. 12.Gasket 32 is preferably substantially the same as that described abovewith the exception that a cavity 78 is formed between gasket 32 andpanel surface 26, primer layer 46, or frit layer 30. Cavity 78 receivesone end 80 of a metal or plastic spring clip which is retained therein.An opposite end 82 of clip 76 extends away from both gasket 32 and panelsurface 26 to engage the edge of pinch flange 31 which forms windowopening 21.

The above embodiments of panel assemblies offer several advantages overprior known structures. These advantages include a weight reduction inthe gasket by as much as two-thirds over prior three-sided, encapsulatedassemblies. The substantial reduction in weight is achieved by usingless material to form gasket 32. As a result, panel assembly 20 is lesscostly to manufacture. Another advantages is that the panel assembly ismanufactured in less than half the cycle time of may prior panels. Thereduced cycle time results in more units being produced in a givenperiod. Another advantages associated with the invention is the abilityto mold gaskets having variable cross sections, depending upon thedesired application. If cross sections are desired which have undercuts,it is contemplated that this invention may be easily incorporated withthe inventions described in U.S. patent application Ser. Nos. 897,764and 898,094, now U.S. Pat. Nos. 5,331,784 and 5,443,673, both of whichare incorporated herein by reference and are assigned to the assignee ofthe instant invention.

MOLD APPARATUS

FIGS. 13-18 illustrate one embodiment of a preferred mold assembly 100of the present invention used in manufacturing the panel assembliesdescribed above. Mold assembly 100 is preferably a three-plate moldhaving a three-plate action which is well known in the industry. Thethree-plate mold contemplated by this invention may be mounted in anyone of a number of presses, including vertical and horizontalshuttle-type presses having clamping pressures on the order of 50 tonsor greater.

Mold assembly 100 includes a fixed plate 102, an intermediate ejectorplate 104, and a cover plate 106. Fixed plate 102 (FIG. 15) ispreferably formed from a wear-resistant steel alloy and includes abottom or lower surface 108, and an upper or top surface 110, bothgenerally rectangular in shape. A guide pin 112 is preferably fixed in ahole 114 located in each corner and extends from surface 110 to engagealignment holes in ejector and cover plates 104, 106, respectively.Located immediately adjacent each guide pin at opposite ends of fixedplate 102, and formed in surface 110, are threaded holes 116 forreceiving a threaded bolt 118. Each bolt 118 retains a bushing 120 forguiding ejector plate 104 toward and away from fixed plate 102. A recessor hole 122, extending into fixed plate 102 from surface 110, andopposite a matching hole 124 in ejector plate 104, retains a spring 126for forcing ejector plate 104 away from fixed plate 102 upon the releaseof the clamping pressure. These springs may be located at the same endsof plate 102 as guide pins 112 and inboard of guide bushings 120.

Located in the central portion of fixed plate 102 is a nozzle bushing128 disposed in a shouldered hole 130 extending through plate 102 andfixed therein by a plurality of equispaced bolts 132. A hemisphericalseat 134 defined at one end is adapted to receive a nozzle from theinjection-molding machine (not shown). A sprue or injection port 136extends from seat 134. Tapered toward surface 108, sprue 136 extendsthrough nozzle bushing 128 and terminates at surface 110 of plate 102.Extending radially from the end of nozzle bushing 128 are a plurality ofrunners 138 machined in surface 110 terminating at their outer reachesin a depression 140 containing an angularly upstanding runner-retainingpeg 142 (see also FIG. 13). Fixed plate 102 has surface 108 held tightlyagainst a platen (not shown) in a conventional manner over an injectornozzle (not shown) by locator bushing 144 received within bushing recess146.

Ejector plate 104, shown in FIGS. 13 and 15, is also tabular in form andsubstantially the same shape as fixed plate 102. Made from the samematerial, ejector plate 104 includes a lower surface 148 adapted to mateand seal with face 110 of fixed plate 102, and an upper surface 150which faces cover plate 106. Ejector plate 104 includes a hole 52located at each corner and lined with a bushing 154 to receive guidepins 112 extending from fixed plate 102. Adjacent each guide hole andbushing 152, 154 is a second hole 156 having a reduced diameter shoulder158 to glide along bushing 120 retained by bolt 118. In thisconfiguration, ejector plate 104 is moved uniformly toward and away fromfixed plate 102 along guide pins 112 in bushing 154 and hole 156 alongbushings 120. The maximum separation between ejector 104 and plate 102is controlled by shoulder 160 on bushing 120 engaging shoulder 158 inhole 156. As mentioned briefly above, ejector 104 is automatically movedaway from plate 102 by springs 126 disposed in opposing cavities 122 and124 when clamping pressure is released.

The upper surface 150 of ejector 104 is machined to produce a relief162, mold cavity 164, and a cavity shut-off area or surface 166. Moldcavity 164 and cavity shut-off 166 are formed in an upstanding ridge 168on ejector surface 150. Mold cavity 164 machined in ridge 168 is thenegative image of gasket 32 to be molded. An advantages offered by thiscavity design is that the only area which requires detailed machining anpolishing is the relatively small area of the cavity shut-off surface166 along the top of ridge 168. Shut-off surface 166 is the only portionof ejector plate 104 which receives and supports glass or other panel22. Since a relatively small shut-off area 166 engages panel 22, fewerpanels are likely to break during the molding process because oftolerance differences in the panels. In addition, mold assembly 100 isless expensive to manufacture because there is less surface arearequiring detailed machining to conform to the surface shape of thepanels. If it is desired to encapsulate and mold-in locating or mountinghardware, a fastener retention device may be located at the bottom ofmold cavity 164. For example, if locating and mounting studs, such asdescribed above, are to be molded and encapsulated within gasket 32, afastener retention device such as 86 is retained in a sink 88 formed inthe bottom of mold cavity 164. Barrel 86 includes a magnet 90 located atone end to magnetically retain a shaft 84 of the locating and mountingstud 82. The exact location of the retention device 86 and the manner inwhich it retains the mounting hardware is dependent upon the desiredlocation of the mounting hardware within the mold cavity.

To locate each panel 22 on shut-off surface 166 and mold cavity 164,several locating techniques may be utilized. In a first embodiment,shown in FIGS. 13 and 17, a plurality of metal or plastic panel locatingpins 170 are mounted to surface 150 outside of ridge 168 and within therelief 162 machined in surface 150. Pins 170 engage peripheral edge 28of panel 22 and precisely locate the panel on surface 166 over cavity164. It is preferred that two such locating pins 170a, 170b be locatedalong one edge or portion of ridge 168 while a third locating pin 170cbe located along an adjacent side or portion to support panel 22 alongat least two sides. Once panel 22 is located above mold cavity 164 bypins 170a-170c, panel 22 may be held tightly in place by a suction pad172 centrally located in relief 162 to the interior of ridge 168.Suction pad 172 has a vacuum end 174 fixed within one end 176 of avacuum port or passage 178 machined in ejector plate 104. Port 178 is,in turn, coupled in fluid communication to a vacuum source to create avacuum between cup 172 and panel 22. It is preferred that vacuum cup 172be used when manually locating panels 22 on mold cavity 164 and shut-offsurface 166. In an alternate embodiment of locating panels 22, a roboticarm (not shown) adapted for transporting panel 22, may have a locatingpin on the arm to engage a female line located at a predetermined pointon ejector surface 150. For example, FIG. 17 illustrates male locatingpin 180, and a female liner 182, respectively, which are retained bybolts 184a, 184b in opposing cavities 186, 188 in the cover plate 106and ejector plate 104, respectively. Female liner 182 in plate 104consistently provides a reference point with respect to mold cavity 164which may be engaged by a pin on a robotic arm.

To provide an avenue for the injected material from radially spacedrunners 138 to mold cavity 164, a plurality of dedicated gating drops190 (FIGS. 13 and 15) are machined in ejector 104. Each gating drop 190extends downwardly from an approximate midpoint in each segment of moldcavity 164 and terminates at a point on the bottom surface 148 ofejector 104 which is directly opposite a depression 140 at the terminusof each runner 138. Thus, each runner 138 and its dedicated gating drop190 provides a path for the injected material to mold cavity 164.

Ejector plate 104 also may contain one or more conduits or passagesextending therethrough. For example, one or more passages 192 (FIG. 13)may be machined in ejector 104 at a predetermined distance directlybelow or adjacent mold cavity 164. Passages 192 are interconnected influid communication with each other in a well known manner to a fluidsource external mold assembly 100 for circulating a conditioned fluidtherethrough. One reason for circulating the fluid would be to maintaina temperature range in the mold assembly and particularly mold cavity164. In one embodiment, it is preferred to circulate a fluid, preferablywater, through ejector plate 104 to maintain a mold cavity temperaturebetween 70° and 190° F., preferably 75°. This substantially constanttemperature of ejector plate 104 provides the best flow characteristicsfor the preferred thermoplastic PVC described above.

A plurality of ejector or poppet pins 194 (FIGS. 13, 16 and 18) arelocated in the bottom of mold cavity 164. For a generally rectangularmold cavity 164, it is preferred that one poppet pin 194 be located ateach of the four corners. Each poppet 194 is preferably driven bycompressed air through a network of air passages 196 extending throughejector plate 106 and coupled in fluid communication through nipple 198to a source of pressurized air (not shown). Each poppet pin 194, uponthe application of air pressure, pushes the finished molded gasketupwards against panel 22 and out of mold cavity 164 to assist inremoving the finished assembly 20 from mold assembly 100.

Overlying and retaining panel 22 against shut-off surface 166 during themolding process is cover plate 106 (see FIGS. 14-18). Cover plate 106 isalso tabular in form and of substantially the same shape as both ejectorplate 104 and fixed plate 102. Also made from a wear-resistant steelalloy typically used in injection molding tools, cover plate 106includes a lower surface 200 which faces but does not engage surface 150of ejector plate 104 and is described in greater detail below, and anupper surface 202 which is mated against the opposite platen or pressureplate (not shown) of the injection press. Extending through the cornersof cover 106 are guide bushing holes 204 lined with a bushing 206substantially identical to holes 152 and bushings 154 described above.As with bushing 154, bushing 206 is aligned with and receives guide pins112 when the three plates are pressed together. Adjacent each hole 204and toward the centerline of cover plate 106 is a hole 208 whichreceives the distal end of bolt 118 and bushing 120 when mold assembly100 is closed.

The lower surface 200 of cover 106 has been machined to form a relief208 for accommodating panel 22 and several additional components. Morespecifically, surface 200 includes a pair of channels 210, 212 whereinchannel 212 is defined in the bottom 214 of channel 210. Theconfiguration of channels 210, 212 is substantially a mirror image ofthe layout of ridge 168 protruding from ejector plate 104 for reasonswhich will be more apparent below. The bottom 214 of channel 210 alsoservices as a shoulder 216 on each side of channel 212, containing aplurality of threaded holes 218 spaced at predetermined intervals.

Disposed in channels 210, 212 and designed to engage surface 24 of panel22 directly opposite mold cavity 164 is a pressure pad assembly 220(FIGS. 15-18). Assembly 220 further includes a resilient, polymericpressure pad 222 disposed in and slightly extending from channel 212. Itis preferred that pressure pad 222 be segmented and be placed end-to-endto extend around substantially the entire length of channel 212. In thismanner, if a particular segment becomes worn or fatigued, the entire pad222 need not be replaced. In the preferred embodiment, pressure pad 222is an alloy of urethane such as that designated GC975 available fromGallagher Corp. of Gurnee, Ill. Pressure pad 222 is preferably retainedin channel 212 by a floating plate 224 shaped to fit freely withinchannel 210. Plate 224 is suspended by a plurality of shoulder bolts 226extending through the peripheral edge of plate 224 and received by holes218 in shoulders 216. The heads of bolts 226 retain plate 224 againstpad 222 while the shaft of bolts 226 allow movement of plate 224 betweenshoulders 216 and the heads of bolts 226.

Retained on the opposite side of floating plate 224, by bolts 228extending through plate 224, is a heat insulative and rigid polymericpad 230. Pad 230 preferably includes a plurality of segments placedend-to-end along floating plate 224 in a shape directly opposing, butwider than, mold cavity 164. One surface 232 of pad 230 has been milledor machined so as to conform, as closely as possible, to the surfacecontour of panel surface 24, to force panel 22 and panel surface 26against cavity shut-off area 166 defined along ridge 168. In a preferredembodiment, pad 230 is made from polyethylene terephthalate (PET)available from Tyerson Plastic of Chicago, Ill. The PET material of pad230 provides excellent heat insulation, is somewhat resilient, and ofmoderate wear durability. Another advantage of using PET is that is maybe molded to conform to the shape of a panel surface, thus avoiding theneed to machine surface 232.

Another material which may be used instead of PET is polyetheretherketone (PEEK) available from Tyerson Plastic of Chicago, Ill. PEEKprovides better heat insulation, but is less resilient, although it hasbetter wear characteristics than PET. However, PEEK is more expensiveand somewhat more difficult to machine.

Located toward the center of surface 200 in relief 208 surrounded bychannels 210, 212, is a suction pad 240 substantially identical tosuction pad 172 described above. Pad 240 has a first end 242 retained ina suction port 244 extending into cover plate 106. Port 244 is, in turn,placed in fluid communication with a vacuum source (not shown) throughpassage 246 and nipple 248. It is contemplated that panel 22 can beloaded against cover plate 106 before closing of mold assembly 100.Location of panel 22 may be had with respect to cover plate 106 usinglocating pins or using robotic placement such as described above. Inanother application, suction pad 240 may also be used to remove panelassembly 20 from ejector plate 104 with the aid of ejector pins 194disposed in the bottom of mold cavity 164.

Cover plate 106 may also contain one or more conduits or passages 250interconnected in fluid communication with each other and to a fluidsource external to mold assembly 100. The fluid circulated throughpassages 250 preferably maintains the temperature of cover 106 atsubstantially the same, or generally close to, the temperature ofejector plate 104, with the two components of substantially the sametemperature, binding or misalignment between the components caused byexpansion or contraction is minimized.

HEATING

FIGS. 19 and 20 are schematic representations of two energy sources thatmay be used in conjunction with molding assembly 100 described above toheat the panel 22 after ceramic frit layer 30 and primer coating 46 areapplied. Although each source is described in relation to producing aparticular energy spectrum, such is by way of example only. Other heatenergy sources may be equally effective such as convective, conductive,inductive and resistive heat sources. Moreover, microwave energy may beused equally as well. In a preferred embodiment, energy sources shown inFIGS. 19 and 20 are located immediately adjacent to mold assembly 100.In this manner, panels do not need to be transported very far beforebeing loaded in mold assembly 100, as described more fully below. Thus,heat is retained and the high temperature necessary for molding toproduce the improved adhesion of this invention is maintained.

FIG. 19 generally illustrates a controlled focused infrared (CFIR)source 300 which may be used either to dry the adhesive primer after ithas been applied to panel 22, or to preheat panel 22 prior to molding ofgasket 32 on panel 22, after the primer is applied over frit layer 30.Infrared source 300 includes one or more infrared emitter assemblies 302such as Model 5305-104 made by Radiant Energy Research, Inc. ofMinneapolis, Minn., and disposed above sheet 22 in a pattern conformingto that region of sheet 22 adapted to receive gasket 32. In thealternative, a single infrared emitter assembly may be moved above sheet22 by a guided robotic arm in a pattern conforming to that area toreceive gasket 32. A computer/process controller 304 preferably causesinfrared emitter assembly 302 to emit infrared energy into sheet 22 froma side opposite that containing frit coating 30 and adhesive primercoating 46, although it may be directed from the same side as the fritand the primer. A spectrophotometer 306 coupled to computer/processcontroller 304 detects the energy reflected and radiated from sheet 22.Based upon the feedback from spectrophotometer 306, controller 304adjusts the power of infrared energy emitted by assembly 302 to obtainmaximum absorption by frit layer 30 and primer coating 46. Absorption ofinfrared energy by frit layer 30 generates heat, preferably raising thetemperature of frit layer 30 and primer coating 46 to more than 250° F.A preferred temperature is within the range of 250° to 450° F. for thepreferred primer described above.

Alternately, the entire area of panel 22 can be heated. FIG. 20,schematically illustrating a controlled area infrared (CAIR) source 400,may include one or more infrared emitters 402 such as Model FB122425B3made by Casso-Solar Corp. of Pamona, N.Y., and may be distributed aboveand aligned with sheet 22. Radiation generated by emitter 402 iscontrolled by a controller 404 based upon input from a thermocouple 406attached to emitter 402, and a spectrophotometer 408 angularly disposedwith respect to sheet 22. A reflector 410 may be disposed beneath sheet22 to reflect heat energy back into the sheet or panel. Panel 22 may besupported above reflector 410 by insulator blocks or spacers 416 toprevent heat loss by conduction into reflector 410. Contemplated in bothof the heating options, but shown only in FIG. 13, is a plenum 412 andan exhaust fan 414, to vent fumes driven off during the heating process.Moreover, each sheet 22 may be properly located with respect to eachheating source by using a template or guide for either the panel orsheet such as 418.

Since the radiation produced by emitters 302 and 402 preferably isintroduced into sheet 22 from a side opposite that containing primercoating 30, it is preferred that sheet 22 have a high transmissivity tothe wavelength of radiation selected. Emitters 302 and 402 both arecapable of producing infrared radiation having a wavelength greater than7.0×10³ Angstroms (Å). The transmissivity of the radiation through eachsheet is greatly effected by its particular characteristics. Forexample, tinted or opaque panels may have a lower transmissivity sincethe pigments or coloration within the material may absorb a portion ofthe radiation. For materials having lower transmissivities, it ispreferred to select wavelengths of radiation which promulgate betterthrough these materials, yet are absorbed by the frit layer. In thepreferred embodiment of this invention, panel 22 is a transparent glasssheet and may be a single sheet or laminated sheets, depending upon thedesired function of the panel assembly.

In order to reduce problems associated with heating and cooling largeexpanses of glass or plastic panels, each of the above radiation sourcesmay direct their energy to a restricted portion of the panel or sheet.For example, since it is desired to heat only that portion of the fritadapted to receive gasket 32, each energy source 302, 402, may beadapted so that the radiation is applied only to that area.Alternatively, each source may be moved around the sheet by a guidedrobotic arm, or a mask may be used to limit the exposed area.

METHOD

Referring to FIGS. 21 and 22, panel assembly 20 described above ismanufactured according to a method which results in superior adhesion ofgasket 32 to a single surface of panel 22 on frit layer 30 and producesa bond substantially impervious to invasion by water. The adherenceobtained between gasket 32 and panel 22 withstand shear forces greaterthan 300 pounds per square inch and 180 degree peel tests of more than30 pounds per linear inch after soaking for at least 250 hours in 175°F. (80° C.) water. It is preferred that any failure occurs in thecohesiveness of the gasket instead of at the bond between the panel andgasket.

Once panel 22 has been obtained with or without frit layer 30 applied tosurface 26, the surface of panel 22 to receive the gasket is cleaned.The preferred cleaning technique is by wiping with a isopropyl alcoholwhich removes oils or other dirt and debris. The alcohol mobilizes anycontaminants and evaporates in a short period of time leavingsubstantially no residue to interfere or degrade the process.

Following cleaning of panel 22, and after sufficient time has lapsed toevaporate any remaining solvent, primer adhesive 46 is applied to thatportion which will be receiving molded gasket 32, and preferably to aslightly larger area. With respect to the embodiments having a gasketsuch as 32, it is preferred that application will be constrained to alinear path on frit layer 30 proximate peripheral edge 28 having athickness within the range of 0.01 and 1.0 mils. For gaskets such as 70shown in FIG. 7, application will be constrained to a linear path alongsurface 24 without frit layer 30, but of the same thickness and alsoproximate peripheral edge 28.

Primer adhesive 46 is preferably Donnelly A-57 which may be applied by aspray, wiper, roller extruder or other technique to the preferredthickness. Since it is anticipated that use of this invention willtypically involve production of a large number of panels, an automatedapplication technique is preferred. One automated process is by a robotapplicator which extrudes a precise coat of primer adhesive 46 to adefined portion of panel 22. To accurately reproduce the roboticapplication of primer adhesive 46, conventional robotic devices requireaccurate positioning of panel 22 in reference to the robotic applicator.

Following the application of primer coating or layer 46, a silanecoupling agent such as Dow Corning's aminoalkyl functional silane Z-6020may be wiped over primer coating 46. In the alternative and saving anextra step of wiping, the silane coupling agent may be premixed withprimer adhesive 46. As mentioned above, the ratio, by weight, of epoxycomponent to silane is greater than 1 and most preferably approximately1.7. The presence of the silane coupling agent improves the adhesivecharacter of the primer.

Subsequent to the application of primer adhesive 46 and any silanecoupling agent, it is preferred CAIR heater 400 be used to heat fritlayer 30 and primer adhesive 46 to a temperature greater than 250° F.and, most preferably, to a temperature between 250° F. and 350° F.,usually 325° F. By heating to about 325° F., sufficient heat is retainedin panel 22, primer 46 and frit layer 30 so that the temperature will beabove 250° F. after transfer of panel 22 from CAIR source 400 to moldassembly 100 and during the molding process. Using CAIR source 400, itis contemplated that the dwell time to achieve a temperature of panel 22within that range to take as long as 20 seconds.

It has been found that by heating panel 22 and adhesive primers 46 ofTable I to a temperature greater than 225° F., and maintaining thattemperature up through the time gasket 32 is molded onto panel 22, anexceptionally strong bond and water resistive barrier is formed betweenpanel 22 and gasket 32. The minimum temperature for each of the primeradhesives 46 shown in Table I at which such a bond occurs is known asthe "primer transition temperature". The "primer transition temperature"may also be defined as that temperature for a given primer where theadhesive quality significantly changes. A better understanding of thisadhesive characteristic and definition may be obtained by referring tothe graph shown in FIG. 22.

FIG. 22 graphically represents the results of experiments using theprimers in Table I in bonding a gasket to a single surface of a glasspanel 22 having a frit layer 30 thereon. The abscissa or X-axis is aplot of the temperature to which panel 22 and each primer 46 was heatedto and generally maintained at the time gasket 32 was molded thereon.The ordinate or Y-axis of the graph is the number of hours the gasketsurvived shear and peel tests after soaking in water having atemperature of 80° C. Points were plotted when the cohesive character ofthe gasket failed, but not if bond between panel and gasket failed.Cohesive failure occurred when 80 percent or more of the gasket wasretained on the panel when subjected to both shear and 180 degree peeltests. Presently, the most stringent standard known to be followed byany automobile manufacturer is 100 hours. That is, the bond between agasket and panel should survive a minimum of 100 hours in the 80° C.watersoak.

To provide consistent results, shear tests were conducted on gasketsbonded to a glass plaque, each gasket having a length of approximately1.0 inch, 0.75 inch wide, and 0.50 inch thick. The shear tests wereconducted transversely to the long axis of the gasket at a rate of 25millimeters per minute. Peel tests were conducted on gaskets 0.75 wide,0.50 thick and of a length sufficient to pull one end 180° back alongthe gasket at a rate of 25 millimeters per minute.

As seen in the graph, substantially every adhesive primer has animproved adhesive quality at a temperature above 225° F. with theexception of conventional water-based PVC primers (curve E). For theadhesive primer designated A-1100 (curve B), a noticeable increase inthe slope of the curve occurs around 250° F., and the slope showsanother significant change around 290° F. The adhesive primer designatedA-47 (curve D) follows a similar curve as does the preferred adhesiveprimer A-57 (curve C). Adhesive primer EXP 541 (curve A) obtains itsmaximum adhesion when heated to approximately 250° F., but shows anoticeable change in the slope of its curve at approximately 200° F.

Referring again to FIG. 20, immediately following heating of panel 22,frit layer 30 and adhesive primer 46 to a temperature greater than orequal to the primer transition temperature, panel 22 is transported fromCAIR 400 and loaded into mold assembly 100 in the manner describedabove, and the mold is closed. One option available in the method beforeloading panel 22 is to load the locating or mounting hardware in moldcavity 164 so that it will be positioned and/or at least partiallyencapsulated by the molded gasket 32. Referring to FIGS. 12 and 16, onemethod for encapsulating the hardware is shown. In one example, locatingand mounting studs 82 include a shaft portion 84 which is receivedwithin a barrel 86 retained in a sink 88 formed in the bottom of moldcavity 164. To retain shaft 84 in barrel 86, a magnet 90 is located atone end to magnetically retain shaft 84 therein. In this fashion, it ispreferred that the stud dimension is such that the remaining portion ofthe shaft 84 including stud head 92 is long enough to be located in moldcavity 164, but not so long as to contact panel 22 when mold assembly100 is closed. Although magnetic retainers are disclosed, mechanicalretainers may be used just as effectively to locate mounting hardware ofvarious kinds in mold cavity 164.

As briefly mentioned above, it is contemplated that this invention willbe implemented using automated machinery. Accordingly, a robotic armwill preferably remove panel 22 from CAIR 400, and according to aprogram, locate the panel in mold assembly 100. In a preferredprocedure, panel 22 will be transported and located against pressure padassembly 220 (FIG. 15) and retained by suction pad 240 by drawing avacuum through passage 246. After panel 22 has been loaded, moldassembly 100 closes, placing primed frit layer 30 in intimate contactwith shut-off surfaces 166 around mold cavity 164. Frit layer 30 onpanel 22 overlies and closes mold cavity 164. Shut-off surfaces 166 andfrit layer 30 form a substantially tight seal as a result of pressurepad assembly 220 forcing panel 22 against ejector plate 104. The heat inpanel 22 is substantially retained since panel 22 only contacts heatinsulating pad 230 and shut-off area 166. Because pad 230 is anexcellent heat insulator, minimal heat loss in panel 22 occurs throughradiation and conduction into shut-off surfaces 166, or into pad 230. Toreduce such heat loss by panel 22, ejector plate 104 and cover plate 106may be heated by a fluid passing through passages 192, 250 milled ineach component. It is preferred that the temperature of the fluid passedthrough one or both of the cover and ejector plates 104, 106 be withinthe range of 70°-190° F., and preferably on the order of 75° F.

With panel 22 loaded in closed mold assembly 100, panel 22 is ready toreceive molded gasket 32. Preferably, when using the VISTA brand PVCdescribed above, the temperature of the PVC at nozzle 128 entering fixedplate 102 is between 350° and 410° F., and most preferably atapproximately 380° F. At this temperature, it is anticipated that thetime to inject the PVC into cavity 164 will take on the order of 0.5second or less, and preferably 0.2 seconds so the PVC contacts panel 22and primer 46 while they are still at or above the primer transitiontemperature. During this period, the molten PVC is passed through sprue136, runners 138, gating drops 190 and substantially fills mold cavity164 at a rate of approximately 40 ounces per second. Using a low stressPVC molding technique, a fill pressure in the range of 15-25 pounds persquare inch gauge (PSIG), as measured in the mold cavity, is used. Usingthis technique, the primer transition temperature or greater is achievedalong the entire length of the bonding interface between panel 22 andgasket 32.

Subsequent to the filling of mold cavity 164, the injected PVC is packedin cavity 164 for two or more seconds at a mold cavity pressure in therange of 70-80 PSIG. Packing assures that mold cavity 164 has beenfilled and allows the material to extend into every portion of thecavity. Following packing, pressure is maintained or held on theinjection for approximately 2 to 3 seconds at a mold cavity pressure onthe order of 55-65 PSIG melt pressure. Once the hold pressure period haslapsed, injection pressure is removed and the injected gasket 32 isallowed to cool, cure, or harden for approximately 20 seconds. Followingpartial curing of gasket 32, mold assembly 100 is opened. Just prior toopening, a vacuum is drawn on suction pad 240 which pulls panel assembly20 away from ejector plate 104. Substantially simultaneously, airpoppets 194, located in the bottom of cavity 164, are activated to pushgasket 32 out from cavity 164. Pushing of gasket 32 and panel 22 awayfrom ejector 104 helps reduce separation of the still curing gasket 32from frit layer 30. When removed at this time, it is believed that thecentral core is partially molten while the outer areas have cooledsufficiently to cure and/or set up. Cycle time for the method is kept toa minimum when the assembly is removed from mold 100 at this stage ofcuring. Overall cycle time for the entire molding process is on theorder of 25 seconds as compared to about 45 seconds for currentthree-sided PVC encapsulation methods. Once the panel assembly is fullyremoved from the mold, and gasket 32 fully sets up and cures throughout,the bond between it and panel 22 is extremely strong. Several differenttest results of the bond achieved using the A-57 adhesive primerpreheated to a temperature of greater than 250° F. are provided in TableII below.

                  TABLE II                                                        ______________________________________                                                              Shear (lbs)                                                                             Peel (lbs)                                    ______________________________________                                        500 Hrs Saltwater Spray                                                                             536.3 ±                                                                              104.8 ±                                                          25.1      6.0                                           1000 Hrs Heat (175° F.)                                                                      513.8 ± 22                                                                           119.7 ±                                                                    10.9                                          1000 Hrs Humidity (98-100% at 100° F.)                                                       464.5.sup.1                                                                             102.5.sup.1                                   240 Hrs Watersoak (80° C.)                                                                   427.83 ±                                                                             87.17 ±                                                          29.69     9.36                                          720 Hrs Watersoak (80° C.)                                                                   532 ± 13.9                                                                           41.5 ±                                                                     4.3                                           1500 Hrs Watersoak (40° C.)                                                                  480.3 ±                                                                              116.0 ±                                                          5.1       5.27                                          ______________________________________                                         .sup.1. Only one sample tested.                                          

1. Only one sample tested.

In addition to the test results set out in the above table, the bondbetween the gasket and panel has withstood the same order of shear forceand peel strength tests for adhesion after soaking for more than 1,000hours in 175° F. (80° C.) water.

With respect to the runners and gating in the above described moldassembly, injection time has been reduced and injection pressure loweredby increasing the number and size of gates and runners from the sprue tothe mold cavity. The increase in the number and size of the gates andrunners lowers the injection pressure which in turn results in a lowerclamping tonnage for the mold assembly. With the reduction in clampingtonnage, panels are less susceptible to breakages when out of tolerance.

Once panel assembly 20 has been formed in mold assembly 100, anadditional step may be followed to assure that the primer transitiontemperature is achieved while in contact with gasket 32, 70. In thisadditional step, assembly 20 is removed from mold assembly 100 andplaced in a separate fixture containing one or the other of heatingsources 300, 400 described above. The assembly 20 is located and heatingsource is activated so as to introduce radiation into panel 22 from aside opposite that receiving the gasket. The infrared energy is absorbedat the contact boundary between the gasket and the panel resulting in anincrease in temperature. If a frit layer is present, the frit is heated.Preferably, the temperature of the frit or boundary is raised to atemperature greater than or equal to the primer transition temperatureto mobilize the primer and further react with the gasket. It ispreferred that the temperature is not so high so as to melt gasket 32,70. Following the post heating, panel assembly 20 is allowed to cool andbe moved on in the assembly process.

The above description is considered that of the preferred embodimentsonly. Modifications of the invention will occur to those skilled in theart and to those who make or use the invention. Therefore, it isunderstood that the embodiments shown in the drawings and describedabove are merely for illustrative purposes and are not intended to limitthe scope of the invention, which is defined by the following claims asinterpreted according to the principles of patent law, including thedoctrine of equivalents.

We claim:
 1. A mold assembly for forming a polymeric structure on onesurface of a sheet-like panel having opposite surfaces, comprising:apair of cooperating mold sections movable between open and closedpositions, said mold sections adapted to receive, engage and hold thesheet-like panel therebetween when said mold sections are in said closedposition, each mold section having a facing surface which faces theother mold section; a mold cavity defined in a first portion of saidfacing surface of a first of said mold sections, said first portion ofsaid facing surface of said first mold section having a support areaadjacent said mold cavity, said support area adapted to support and sealagainst the one surface of the sheet-like panel such that said moldcavity opens to the one surface of the panel when the panel is heldbetween said mold sections in said closed position; a heat insulativepad on the second of said mold sections, said pad being urged againstthe surface of the sheet-like panel which is opposite the one surface ata position opposite said mold cavity to hold the one surface of thepanel against said support area and overlying said mold cavity when saidmold sections are in said closed position; and a resilient memberlocated between said heat insulative pad and said second mold section,said resilient member urging said heat insulative pad against theopposite surface of the panel when said mold sections are in closedposition, whereby when a polymeric molding material is introduced insaid mold cavity, a polymeric structure defined by said mold cavity willbe formed on the one surface of the panel.
 2. The mold assembly of claim1 wherein said first portion of said facing surface of said first moldsection which includes said mold cavity is offset above a second portionof said facing surface, said support area including a finished surfaceoffset from said second portion of said facing surface, and adjacent andextending along said cavity, said finished surface sealing against theone surface of the sheet-like panel when the panel is held between saidmold sections in said closed position.
 3. A mold assembly for forming apolymeric structure on one surface of a sheet-like panel having oppositesurfaces, comprising:a pair of cooperating mold sections movable betweenopen and closed positions, said mold sections adapted to receive, engageand hold the sheet-like panel therebetween when said mold sections arein said closed position, each mold section having a facing surface whichfaces the other mold section; a mold cavity defined in a first portionof said facing surface of a first of said mold sections, said firstportion of said facing surface of said first mold section having asupport area adjacent said mold cavity, said support area adapted tosupport and seal against the one surface of the sheet-like panel suchthat said mold cavity opens to the one surface of the panel when thepanel is held between said mold sections in said closed position; and aheat insulative pad on the second of said mold sections, said pad beingurged against the surface of the sheet-like panel which is opposite theone surface at a position opposite said mold cavity to hold the onesurface of the panel against said support area and overlying said moldcavity when said mold sections are in said closed position whereby whena polymeric molding material is introduced in said mold cavity, astructure defined by said mold cavity will be formed on the one surfaceof the panel; said first portion of said facing surface of said firstmold section which includes said mold cavity being offset above a secondportion of said facing surface, said area of said first portion of saidfacing surface of said first mold section including a finished surfaceadjacent and extending along said cavity which seals against the onesurface of the sheet-like panel; said heat insulative pad having an areaengaging the opposite surface of said sheet-like panel, said area beinggenerally corresponding in size to the size of said offset portion ofsaid facing surface of said first mold section.
 4. The mold assembly asdefined by claim 3, further including:a resilient member between saidheat insulative pad and said second mold section; and at least onefastener for retaining said insulative pad in said second mold section.5. The mold assembly of claim 4 wherein said resilient member is formedfrom urethane; said heat insulative pad being formed from one of thematerials selected from the group consisting of polyether etherketoneand polyethylene terephthalate.
 6. The mold assembly as defined by claim3, wherein said first mold section includes a central area and an outerperiphery; a runner and gate system for directing molding material tosaid mold cavity; an ejector disposed at a predetermined location insaid first mold cavity for ejecting the sheet-like panel and thepolymeric structure from said cavity; and a holder for holding saidsheet-like panel on said first mold section; said holder being locatedin said central area of said first mold section; said mold cavity spacedtoward said outer periphery of said first mold section from said holder.7. The mold assembly as defined by claim 6, further including meansbelow said mold cavity and extending through said first mold section forchanging the temperature of said mold cavity.
 8. The mold assembly asdefined by claim 6, wherein said first mold section also includes aguide for locating the sheet-like panel on said first mold section; saidguide including a plurality of locating members fixed at positionsspaced toward said outer periphery of said first mold section from saidmold cavity to engage a peripheral edge of the sheet-like panel.
 9. Themold assembly as defined by claim 6, wherein said first mold sectionalso includes a guide for locating the sheet-like panel on said firstmold section; said guide including at least one female fitting forreceiving a locating pin on a panel transporting arm, said femalefitting spaced toward said outer periphery of said first mold sectionfrom said mold cavity.
 10. The mold assembly of claim 3 wherein saidsecond mold section includes a central area, an outer periphery, and aholder for holding the sheet-like panel on said second mold section,said holder located in said central area, said heat insulative padspaced toward said outer periphery from said holder.
 11. The moldassembly of claim 10 wherein said first mold section includes a centralarea, an outer periphery, and a holder for holding the sheet-like panelon said first mold section, said holder located in said central area,said mold cavity spaced toward said outer periphery from said holder.12. A mold assembly for forming a polymeric structure on one surface ofa sheet-like panel, comprising:a pair of cooperating mold sectionsmovable between open and closed positions, said mold sections adapted toreceive, engage and hold the sheet-like panel therebetween when saidmold sections are in said closed position, each mold section having afacing surface which faces the other mold section; a mold cavity definedin a first portion of said facing surface of a first of said moldsections, said first portion of said one facing surface of said firstmold section having a support area adjacent said mold cavity, saidsupport area adapted to support and seal against the one surface of thesheet-like panel such that said mold cavity opens to the one surface ofthe panel when the panel is held between said mold sections in saidclosed position; a pressure pad on the second of said mold sections, anda resilient member located between said pressure pad and said secondmold section, said pressure pad being urged by said resilient memberagainst the surface of the sheet-like panel which is opposite the onesurface at a position directly opposite said mold cavity to hold the onesurface of the panel against said support area and overlying said moldcavity when said mold sections are in said closed position; said firstportion of said facing surface of said first mold section being offsetabove a second portion of said facing surface, said pressure pad havingan area engaging the opposite surface of said panel, said area generallycorresponding in size to the size of said first portion; whereby when apolymeric molding material is introduced in said mold cavity, astructure defined by said mold cavity will be formed on the one surfaceof the panel.
 13. The mold assembly of claim 12 wherein said pressurepad includes a generally rigid heat insulating member adapted to engagethe opposite surface of the sheet-like panel.
 14. The mold assembly ofclaim 13 wherein said resilient member is formed from urethane; saidheat insulating member being formed from the group consisting ofpolyether etherketone and polyethylene terephthalate.
 15. The moldassembly as defined by claim 12, wherein said first mold sectionincludes a central area and an outer periphery; a runner and gate systemfor directing molding material to said mold cavity; an ejector disposedat a predetermined location in said first mold cavity for ejecting thesheet-like panel and the polymeric structure from said cavity; and aholder for holding said sheet-like panel on said first mold section;said holder being located in said central area of said first moldsection; said mold cavity spaced toward said outer periphery of saidfirst mold section from said holder.
 16. The mold assembly as defined byclaim 15, further including means below said mold cavity and extendingthrough said first mold section for changing the temperature of saidmold cavity.
 17. The mold assembly of claim 15 wherein said first moldsection also includes a guide for locating the sheet-like panel on saidfirst mold section, said guide spaced toward said outer periphery ofsaid first mold section from said mold cavity.